Silicon-aluminum composites for packaging have been successfully developed

In recent days, Beijing Beike Uniformity Phenylphthalide Carbon Fluoride Xing Xingxu Competition Jing Benben Piao Ping Meal Meal Armament ┦ ┦ ┦ 莆 橹 橹 槭铡 槭铡 槭铡 槭铡 槭铡 槭铡 槭铡 / /

The high-silica-aluminum composite material has the advantages of light weight, low expansion, high thermal conductivity, and the like, and is currently the mainstream material for high-power and high-density electronic device packaging. The market demand in the aerospace and electronic equipment field is strong. At present, the patented technology for spray deposition of high-silicon-aluminum composites is owned by the British company, which is expensive and has an embargo risk. The development of high-silica-aluminum composite materials with independent intellectual property rights is of great significance for upgrading the application level of key electronic equipment materials in China, breaking the foreign technology blockade, and promoting relevant technological progress.

Under the support of the Municipal Science and Technology Commission, Beijing Beike Chemical Co., Ltd., Xinghuan Chemical Co.,Ltd.牍 牍 ? ? ? ? ? ? ? 汗 汗 汗 汗 橹 橹 橹 胄 芴荻 芴荻 芴荻 芴荻 芴荻 嫉缱臃庾 芸 芸 芸 芸 芸 芸 芸 芸 芸 芸 芸 芸 芸 芸 芸 幌 灾 灾 灾 灾 灾 灾馔 馔 嗖 嗖 嗖 嗖 嗖 嗖 芟嗟 芟嗟 芟嗟 芟嗟 3 3 3 3 3 3 0% 0% 0% -30% of high-performance high-silicon-aluminum composite materials, while the new technology also has a short process, product performance adjustable controllable, etc., is expected in the space structure Materials and automotive engine cylinder liners, pistons and other key components have been widely used.